| 1 |
Manufacturer 01 |
Vapor chamber assemblies, heat pipes, fin-stack coolers |
150–450 W GPU thermal design power |
High-volume graphics-card cooling modules |
Copper base plates, aluminum fins, copper heat pipes |
Dual-slot, triple-slot, workstation and server layouts |
High |
Leak testing, thermal resistance testing, fan endurance testing |
| 2 |
Manufacturer 02 |
All-in-one liquid coolers, cold plates and pump assemblies |
200–700 W GPU thermal design power |
Liquid-cooling solutions for AI and data-center hardware |
Nickel-plated copper, aluminum radiators, EPDM tubing |
Rack servers, workstations and accelerator platforms |
High |
Pressure decay, flow-rate, pump-life and corrosion testing |
| 3 |
Manufacturer 03 |
Direct-touch heat-pipe coolers and axial-fan modules |
100–350 W GPU thermal design power |
Consumer and professional graphics cooling |
Nickel-plated copper heat pipes, aluminum fin arrays |
Single-slot, dual-slot and compact desktop designs |
Medium–High |
Fan vibration, acoustic, thermal cycling and dimensional checks |
| 4 |
Manufacturer 04 |
Immersion-cooling components and liquid distribution plates |
300–1,000 W GPU thermal design power |
High-density computing and server thermal management |
Copper, stainless steel, engineered polymers and seals |
Data-center trays, server nodes and accelerator systems |
High |
Fluid compatibility, pressure, flow uniformity and thermal-load testing |
| 5 |
Manufacturer 05 |
Blower coolers, radial fans and compact heatsinks |
75–250 W GPU thermal design power |
Space-constrained industrial and embedded GPU systems |
Aluminum extrusions, copper inserts and glass-fiber plastics |
Small-form-factor, embedded and industrial platforms |
Medium |
Airflow, acoustic, dust-ingress and operating-temperature tests |
| 6 |
Manufacturer 06 |
Passive heatsinks, heat spreaders and hybrid cooling modules |
35–200 W GPU thermal design power |
Fanless and low-noise electronics cooling |
Aluminum, copper, graphite sheets and thermal interface materials |
Embedded computers, industrial PCs and edge devices |
Medium |
Thermal mapping, interface flatness and environmental cycling |
| 7 |
Manufacturer 07 |
Cold plates, manifolds and custom liquid-loop assemblies |
250–800 W GPU thermal design power |
Custom OEM and original design manufacturing projects |
Machined copper, aluminum, stainless steel and elastomer seals |
AI servers, HPC systems and liquid-cooled workstations |
Very High |
CNC inspection, helium or pressure leak testing and flow validation |
| 8 |
Manufacturer 08 |
Vapor chambers, fin stacks and low-profile heat-pipe solutions |
120–400 W GPU thermal design power |
Thin, high-density graphics and computing equipment |
Vacuum-brazed copper, aluminum fins and soldered joints |
Thin workstations, compact servers and multi-GPU systems |
High |
Vacuum integrity, brazing quality, thermal performance and X-ray inspection |
| 9 |
Manufacturer 09 |
GPU backplates, heat spreaders and auxiliary cooling parts |
80–300 W GPU thermal design power |
Mechanical and thermal subassemblies for graphics hardware |
Stamped aluminum, copper sheets, stainless steel and silicone pads |
Desktop graphics cards, workstation cards and custom boards |
Medium–High |
Coating inspection, flatness measurement, assembly checks and thermal testing |
| 10 |
Manufacturer 10 |
Fans, fan trays and complete air-cooling subassemblies |
100–500 W GPU thermal design power |
System-level airflow and thermal integration |
Aluminum, copper, reinforced polymer and ball-bearing components |
Server chassis, GPU workstations and rack-mounted systems |
Medium–High |
Airflow, static-pressure, acoustic, vibration and reliability testing |