Profile 1 High-Purity Quartz | Fused quartz | DiffusionOxidationHigh-temperature anneal | 182 mm and 210 mm wafers; size-specific tooling required | 25–50 slots | Approximately 1,000 °C in furnace service, subject to furnace design | Very low thermal expansion, approximately 0.5 ppm/K; minimizes dimensional change during thermal cycling | Edge-polished slots, controlled surface roughness, dedicated quartz cleaning, visual inspection for chips and devitrification | ≤0.05% per transfer step after line qualification | Megasonic or chemical cleaning where compatible; scheduled inspection for cracks, haze and particle generation | Furnace boats and high-temperature diffusion or oxidation operations |
Profile 2 High-Performance Polymer | PEEK or modified PEEK | Wet cleanTexturingPECVD handling | M10 182 mm, M12 210 mm and rectangular wafer variants | 25–50 slots | Continuous service commonly around 200–250 °C, depending on grade and load | Higher expansion than metals and ceramics, typically around 40–50 ppm/K; slot clearance must be compensated | Low-outgassing grade, rounded slot entrances, conductive or dissipative options, barcode or RFID traceability | ≤0.10% per transfer step after recipe optimization | Alkaline or solvent-compatible cleaning according to resin grade; avoid uncontrolled high-temperature drying | Flexible automated lines requiring chemical resistance and low wafer-contact damage |
Profile 3 High-Chemical-Resistance Polymer | PVDF, PTFE or PFA-lined construction | Acid cleanAlkaline cleanWet benches | 182 mm and 210 mm wafers; configurable for thin-wafer handling | 25–100 slots | Typically 80–260 °C depending on polymer, load and exposure time | High polymer expansion; requires generous thermal and dimensional tolerance control | Fluoropolymer contact surfaces, low-metal-ion specification, drain-through geometry, dedicated chemical-service identification | ≤0.15% per transfer step in qualified wet-process handling | Use process-specific acid or alkaline cleaning; prohibit mixed-service use to prevent chemical cross-contamination | High-throughput wet processing where chemical purity is more important than thermal rigidity |
Profile 4 Anodized Aluminum | Hard-anodized aluminum with polymer contact inserts | AutomationBuffer storageRoom-temperature transfer | M10, M12, 182R and 210R formats with interchangeable inserts | 25–100 slots | Commonly −20 to 150 °C, subject to coating and insert specification | Aluminum expansion is approximately 23 ppm/K; coating thickness and insert retention affect slot alignment | Hard-anodized surfaces, replaceable contact pads, slot-pitch inspection, carrier presence sensors and lot traceability | ≤0.10% per transfer step in controlled automation | Neutral or mildly alkaline cleaning; inspect coating wear, exposed metal and insert deformation | Low-cost, lightweight cassette fleets used between major process modules |
Profile 5 Silicon-Carbide Composite | Reaction-bonded or recrystallized SiC | High-temperature furnaceDiffusionRapid thermal process | 182 mm and 210 mm wafers; furnace-specific geometry | 25–50 slots | Often suitable above 1,000 °C, depending on composition and atmosphere | Low expansion, approximately 4–5 ppm/K; strong thermal-shock resistance relative to many ceramics | High stiffness, low deformation, controlled porosity, edge finishing and periodic particle qualification | ≤0.05% per furnace load after thermal-profile validation | High-purity deionized-water or approved chemical cleaning; monitor oxidation and surface wear | Repeated high-temperature cycles where dimensional stability and long service life are priorities |
Profile 6 Technical Ceramic | Alumina or zirconia-toughened alumina | Thermal treatmentPlasma-compatible handlingSpecialty lines | 182 mm and 210 mm formats; generally custom-designed | 25–50 slots | Typically 800–1,200 °C depending on ceramic grade and thermal cycle | Alumina expansion is commonly around 7–8 ppm/K; rigidity is high but brittle-impact sensitivity must be managed | High hardness, low deflection, polished contact surfaces, slot-radius control and non-destructive crack inspection | ≤0.08% per transfer step after impact and alignment validation | Particle-controlled wet cleaning; inspect for microcracks, chipped slot edges and glaze degradation | Specialized thermal or plasma processes requiring stiffness and low deformation |
Profile 7 Hybrid Low-Particle Cassette | Metal frame with PEEK, PPS or fluoropolymer contact components | TOPConHJTMulti-module automation | M10, M12 and rectangular formats; tool-less format conversion available on selected designs | 25–100 slots | Typically 80–220 °C, depending on contact material and process module | Mixed-material design requires controlled differential expansion and verified slot alignment across temperature changes | Replaceable wear parts, low-particle contact tips, anti-static options, carrier ID, recipe-linked maintenance and vision inspection | ≤0.08% per transfer step with optimized robot speed and alignment | Modular cleaning; replace contact components at defined cycle counts and trend particles by cassette ID | High-volume lines that need one traceable cassette platform across multiple cell technologies |