| 1 | Device and package | Exact Versal Premium device, package, speed grade, and enabled transceiver resources. | Transceiver availability and supported operating rates are device- and configuration-dependent. | Request the complete part number and resource map. |
| 2 | Transceiver lane count | Number of GTM lanes routed to usable board connectors, plus any lanes reserved or left unrouted. | A device’s transceiver resources do not automatically translate into accessible board I/O. | Compare routed lanes with system lane demand. |
| 3 | Rate and modulation support | Documented line rates, PAM4/NRZ modes, reference-clock requirements, and applicable operating conditions. | 112 Gb/s PAM4 is a transceiver capability ceiling for applicable GTM configurations, not a guarantee for every board channel. | Validate the target protocol and rate against device documentation. |
| 4 | Connector and cage options | Connector type, lane mapping, cage/mechanical compatibility, and supported optical or electrical module interfaces. | Connector choice and module implementation affect channel loss, reach, and system interoperability. | Request connector pinout and module compatibility details. |
| 5 | PCB stack-up and materials | Layer stack-up, dielectric material data, copper specifications, and controlled-impedance targets for high-speed routes. | Loss and impedance discontinuities can constrain high-speed channel performance. | Ask for stack-up and impedance-control documentation. |
| 6 | Channel characterization | Insertion-loss and return-loss data, channel models, simulation results, and measurement reference planes. | Channel performance must be assessed across the complete path, including package, PCB, connector, and module. | Request measured or modeled channel evidence at the target rate. |
| 7 | Clocking and jitter | Reference-clock sources, frequency options, jitter specifications, clock routing, and any required clock-cleaning circuitry. | High-speed links require clocking that meets the selected transceiver and protocol requirements. | Check clock plans against the target protocol configuration. |
| 8 | Power and thermal design | Power-rail capacity, sequencing, cooling provisions, airflow assumptions, and thermal monitoring. | Transceiver operation and overall system stability depend on suitable power integrity and thermal conditions. | Review power budgets and cooling requirements for the intended workload. |
| 9 | Bring-up and debug access | JTAG access, status indicators, loopback options, test points, and documented transceiver diagnostic workflows. | Accessible diagnostics help isolate link, clocking, configuration, and signal-integrity issues. | Confirm the debug method and available board support files. |
| 10 | Documentation and support | Schematics, constraints, reference designs, software examples, compliance evidence, lifecycle status, and support terms. | Complete documentation reduces integration risk and supports reproducible validation. | Assess documentation completeness and long-term availability. |